Via Fill
The PCB’s via is a key component that transmits signal from one layer to another. The via can also function as an outlet to transfer heat away from the IC or other components on the PCB. Using proper techniques is important to prevent issues like voids, copper weight increases or defects when designing your PCB and manufacturing it.
The best ways to improve the flexability of a rigid PCB are through the use of special structures and intrinsically flexible materials. The former involves the creation of special designs that can deform more easily, while the latter focuses on developing intrinsically flexible materials to replace rigid ones. In both cases, a flexible structure is needed to reduce the force required to bend the battery.
Via fill is the process of using a conductive or non-conductive epoxy to seal a plated through hole (PTH). It is used to avoid impurities, increase mechanical strength, and allow for the placement of SMT components. It also helps strengthen pad attachment, reduce solder wicking, and ensure silkscreen printing quality. It can also enhance the current capacity of a circuit board and improve its thermal conductivity.
Flexible Batteries and Via Fill
Conductive via fill is the most common type of via fill used in PCBs. It uses silver or copper epoxy matrices to provide electrical and thermal conductivity. Some of the most popular conductive via fills include DuPont CB100 and Tatsuto AE3030. They offer similar features, but AE3030 has a smaller particle size and a lower finished co-efficient of expansion (CTE).
While the most popular choice is copper via fill, there are other options that may be more suitable for your design. For example, a non-conductive via fill can be made with a low shrinkage epoxy that does not affect the performance of the copper plated through hole. It is a great option for situations where the circuit boards will be exposed to high temperatures and can also help with cost savings.
Another benefit of via fill is that it can be used to close or shut unused vias during the manufacturing process. This can reduce the number of holes that need to be filled, which can save money and time. However, it is important to note that this method may not be as reliable as other via fill methods.
A newer technique for enhancing flexibility is to utilize via-in-pad. This allows you to connect more layers with fewer holes and can reduce the amount of copper that is needed. It can also be more reliable because it helps reduce the chances of trapped air or liquids.
In addition to via fill, there are other ways to improve the flexability of Printed Circuit Boards (PCBs). These include the use of a FR4 dielectric material and the incorporation of an external power delivery network. These can significantly decrease the bending radius of the PCB. This can make it possible to manufacture battery cells in a variety of shapes. It can also be used to create multi-cell modules that have a larger capacity and can be more easily shipped.
